3 in 1 WL Nand Reballing Stencil Positioning Mold For iPhone 5-12 Pro Max

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Option: 3 IN 1 WL Hard Disk BGA
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Description

3 IN 1 NAND BGA Reballing Stencil Template Mold For iPhone 6-12Pro Max. WL high-accuracy BGA Reballing Stencil template for iPhone 6-12Pro Max NAND and Baseband Soldering Repair. WL Hard Disk Baseband Magnetic Plattorm Tinned Steel Mesh NAND BGA Reballing Tin Net Stencils With Position Fixture for Iphone 5-12 Pro Max.


[ Optional Types ] :
Option 1: 3 IN 1 WL NAND Hard Disk BGA Reballing Stencil
Option 2: Universal Positioning Mold
Option 3:WL NAND BGA Reballing Stencil With Magnetic Base
 

Feature:
Quality is very good
Magnetic base + positioning plate + tin mesh ( Together to use )
WL BGA reballing stencils kit come with black positioning mold
WL high accuracy BGA reballing stencils template for iPhone 5S 6 6P 7 8 X XS Max  11PRO MAX 12 series soldering repair
 

Notice :
Black positioning mold with fixed plate, easy to use and more accurate CPU IC welding position.
The Black Positioning Mold just match with the right BGA Reballing Stencil.

Option Aluminum Mold Base: it is universal, can fit with any black positioning mold, ( Choose different package ), and just 1pcs aluminum mold base, easy for your working, and also save money.

Option Positioning Mold - Black: Not universal, can't working with different BGA reballing stencil, need the right model BGA reballing stencil, the black positioning mold just match with the right BGA reballing stencil.

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