Description
PHONEFIX Meizu MX4 Universal CPU BGA Reballing Stencil Template, 0.12MM MT6595W CPU Chip BGA Reballing Stencil, with imported steel material and heat dissipating holes for professional mobile phone soldering. MT6595W CPU Reballing Stencil can work great with any universal phone repair BGA rework station on Meizu MX4 Series Cell Phones.
0.12MM Meizu MX4 CPU BGA Reballing Stencil Template MT6595W For Android Phone CPU RAM Soldering Repair Tool.
Package included :
1pcs x BGA Reballing Stencil Template
