WL Golden BGA Reballing Stencil for iphone 5S 6 7 8 X XR XS MAX

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VIPProgrammerSKU: FX566

Option: XS MAX/XR
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Description

WL golden BGA reballing stencil soldering repair metal net for iPhone 6 to iPhone 14 Pro Max motherboard BGA reballing soldering repair. WL BGA tin planting metal mesh for BGA reballing stencils template for iPhone power logic / communication baseband module IC chip. WL golden steel mesh iPhone motherboard NAND / baseband / Wifi / Audio IC CPU A8-A15 BGA reballing stencil.

WL Golden BGA Reballing Template Steel Net Tin Planting Stainless Steel Mesh For iPhone 5 5C 5S 6 6SP 7 8 X XS MAX 11 12 13 14 Pro Max Motherboard Soldering Repair.

Option:
Option 1: for iPhone 6 6P.
Option 2: for iPhone 6S 6SP.
Option 3: for iPhone 7 7P.
Option 4: for iPhone 8 8P X.
Option 5: for iPhone XS MAX XR.
Option 6: for iPhone 11/11Pro/11Pro Max.
Option 7: for iPhone 12/12Pro/12Pro Max/12 mini.
Option 8: for iPhone 13/13 Pro/13 Pro Max/13 mini.
Option 9: for iPhone 14/14Plus/14 Pro/14 Pro Max.

Features:
Easy to use
High quality material
Design - Designed to help with repairs
Durable - Made of metal allowing a lot of uses
Perfect for reballing IC chips on iPhone 5 5C 5S 6 6P 6S 6SP 7 7P 8 8P and iPhone X XS MAX 11 12 13 14 Pro Max.

Package includes:
1pcs x WL Golden BGA Reballing Stencil

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