183℃ Sn62.8-Pb36.8-Ag0.4 Solder paste Phone BGA Soldering Tin Cream

VIPProgrammerSKU: FIX229

size: Needle tube 42g
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Description

Medium temperature 183℃ Sn62.8/Pb36.8/Ag0.4 lead solder paste 55g, phone motherboard BGA chip soldering tin cream, melting point 183℃ Medium temperature phone PCB BGA solder flux paste, High quality medium temperature tin paste melting point is about 183℃.

Medium temperature solder paste with lead, melting point is 183℃, Sn62.8/Pb36.8/Ag0.4, 55g or 42g.

Two types of packaging:
1: Syringe packaging: Needle tube
FIX-229 Sn62.8/Pb8/Ag0.4 42g
2: Canned packaging:
FIX-228 Sn62.8/Pb36.8/Ag0.4 55g

Good conductivity
Shining solder joints
Good moisturizing
Full solder joint
Good tin drop performance

Features:
1. With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
2. Wettability and demould properties are good, anti-cold & hot collapse and anti-dry are strong.
3. Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.
4. Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.

Note: Solder paste flux, liquid and rosin can only be sent by special post mail.

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