Amaoe MFix iPhone Motherboard Middle Layer BGA Plant Tin Platform

VIPProgrammerSKU: AmaoeMFix

Option: MFix-X/XS/XM (MFix Set)
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Description

Amaoe Easy Repair MBGA Mbga MFix Phone Motherboard Middle Layer Tin Planting for iPhone X-15Pro Max Fixing and Repair. AMAOE MFix Mobile phone motherboard maintenance fixture middle layer tin plant platform IP for iPhone X-15 Series. Amaoe BGA Stencil Plaform For iPhone X/XS/11/12/13/14/15 Pro MAX Motherboard Fixed Fixture Middle Frame Tin Template Soldering Steel Mesh.

Features:
1. Motherboard fixing and repair, middle layer tin planting, CPU and hard disk fixing and removing glue.
2. For different motherboard structures, multi-dimensional alr avoidance eliminates the need to remove the adhesive and the fixing sheet to improve work efficiency.
3. Height difference synthetic stone positioning clip to prevent pressure damage to copper sheets/cables.
4. Modular design, split structure, each fixture can be operated independently for glue removal, which is more efficient to use.
5. Ergonomic design for easy opening and closing of components and clamping of the motherboard.
6. The positioning pin is inserted into the positioning hole, and the magnet is attached to the bottom screw, which can be quickly and easily fixed.

Package includes:
2 x Tin scraping blade
1 x Gaskets
2 x Fixture
1 x Magnetic base
2 x Stencil

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